Detailansicht
Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
Lee, Tae-Kyu/Bieler, Thomas R/Kim, Choong-Un et al
ISBN/EAN: 9781461492658
Umbreit-Nr.: 5588534
Sprache:
Englisch
Umfang: xiii, 253 S., 70 s/w Illustr., 81 farbige Illustr.
Format in cm:
Einband:
gebundenes Buch
Erschienen am 06.11.2014
Auflage: 1/2015
- Zusatztext
- This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
- Kurztext
- This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: - Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of leadfree soldering technique Explores emerging technologies in leadfree soldering