Detailansicht
Advanced Signal Integrity for High-Speed Digital Designs
eBook - IEEE Press
ISBN/EAN: 9781118210680
Umbreit-Nr.: 3656510
Sprache:
Englisch
Umfang: 688 S., 42.49 MB
Format in cm:
Einband:
Keine Angabe
Erschienen am 20.09.2011
Auflage: 1/2011
E-Book
Format: EPUB
DRM: Adobe DRM
- Zusatztext
- <b>A synergistic approach to signal integrity for high-speed digital design</b><p>This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital designcreating the optimal combination between theory and practical applications.</p><p>Following an introduction to the importance of signal integrity, chapter coverage includes:</p><ul><li>Electromagnetic fundamentals for signal integrity</li><li>Transmission line fundamentals</li><li>Crosstalk</li><li>Non-ideal conductor models, including surface roughness and frequency-dependent inductance</li><li>Frequency-dependent properties of dielectrics</li><li>Differential signaling</li><li>Mathematical requirements of physical channels</li><li>S-parameters for digital engineers</li><li>Non-ideal return paths and via resonance</li><li>I/O circuits and models</li><li>Equalization</li><li>Modeling and budgeting of timing jitter and noise</li><li>System analysis using response surface modeling</li></ul><p>Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material.<i>Advanced Signal Integrity for High-Speed Digital Designs</i> is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.</p>
- Autorenportrait
- <b>STEPHEN H. HALL</b> is a Senior Staff Engineer at Intel Corporation, where he leads a team focused on the research of new modeling and measurement solutions for channel speeds as high as 30Gb/sec. Previously at Intel, he was the lead designer for desktop and server buses on Pentium II, III, and IV based systems, coordinated research in the area of high-speed signaling with multiple universities, led research and development teams in the area of high-speed modeling, and taught signal integrity courses to engineers in two countries. He is also the author of<i>High-Speed Digital System Design</i> (Wiley).<p><b>HOWARD L. HECK</b> is a Principal Engineer at Intel Corporation, where he leads development of the signaling specifications and solutions for USB 3.0. He also teaches high-speed digital interconnect design at the Oregon Graduate Institute, is a Senior Member of the IEEE, and holds five patents in the area of high-performance packaging and interconnects, with five more pending.</p>